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Dow Corning Corp. said a thermally conductive compound, developed for use in Intel's latest mobile processor, is now commercially available. The compound, applied between a chip and its heat sink to carry away heat, can also be used for automotive power devices, LEDs, FPDs and other heat-sensitive systems....More

The principles behind the stability and electronic properties of metallic gold nanoclusters have been described, opening the door to new applications for materials, superconductivity and even self-assembly....More

Shin-Etsu Polymer has developed a lightweight resin frame to handle and transport thinned wafers. The resin frame would replace the conventional stainless steel frames that tend to produce metallic contamination during wafer handling. Thinned wafers are increasingly being used for chips that have 3-D interconnects and ultrathin packages....More

A solution to the long-sought fabled molecular switch appears to have been found by researchers at Michigan Technological University....More

Alchimer SA said experiments have shown that its “electrografting” technology can handle deposition of the insulation, barrier and seed layers in through-silicon vias (TSVs). The privately held company also said its technology is being adopted by the CMOS image sensor vendors....More

AmpTech Inc. said it is ready to do business as a foundry for RF and optoelectronic ICs. The company bought an existing fab last year and is in production with power amplifiers and other chips aimed at mobile wireless devices....More

Following the general trend of the semiconductor manufacturing ecosystem, sales of SOI technology slowed in 2007 to a 6% year-over-year revenue increase at $654 million. The single-digit growth pales in comparison to the 46% and greater growth in each of the three previous years, according to VLSI Research, which further reports that 2008 SOI sales are expected to be slightly down from 2007 and that the following years will see double-digit growths stimulated by the 45-nm transition....More